Description
Thermal Dissipation Product
Our product is made by incorporating fillers into the matrix, designed to dissipate heat without being electrically conductive, thus acting as insulators. This material is enriched with boron, alumina, and other specialized fillers. The heat dissipation capability is measured in W/m-K.
Regulations
The product complies with MIL I 49456 standards, which define its characteristics and performance.
Properties
The material can have different Shore A hardness levels, ensuring perfect flatness between two contact surfaces. This approach helps optimize heat dissipation.
Applications
It is particularly suitable for situations requiring effective thermal dissipation, considering the heat generated by electronic devices inside enclosures. Our products offer various thicknesses and thermal parameters ranging from 0,9 a 3,5 W/m-K, and can include structured adhesives to facilitate placement.
Supply
The material is available in sheets of various thicknesses and can be customized to ensure optimal application on electronic circuits or metallic components, such as die-cast aluminum.
